Qualcomm working to optimize Snapdragon 845 chipset for mixed reality use

Qualcomm’s next top-of-the-line chipset, the Snapdragon 845, will power more than just the next series of high-end handsets. The chip has capabilities built-in to allow it to run mixed reality devices. The Adreno 630 GPU will support wall-collision detection, important if the world you are looking at is not really the world you’re standing in. In addition to consuming 30% less power than the Snapdragon 835 chipset, the new component employs Qualcomm’s third-generation AI platform that can offer scene and object recognition while on the move.

Just the other day, Qualcomm announced that it …


Xiaomi confirms its next flagship will be equipped with Qualcomm's Snapdragon 845 chipset

In case you’re wondering, Qualcomm has just taken the wraps off its new Snapdragon 845 chipset during a Tech Summit held in Hawaii earlier today. However, not many details are available about the insides and performances of the new chipset, but we did catch some newsworthy information from the event.

Lei Jun, Xiaomi’s CEO confirmed on the stage at the Snapdragon Tech Summit that the company’s upcoming flagship smartphone will be powered by Qualcomm’s Snapdragon 845 processor. He didn’t name the device, but previous reports claim the flagship will be launched on …

Qualcomm's powerful Snapdragon 845 chipset goes official

Qualcomm reserved about 10 minutes to the unveiling of its new Snapdragon 845 chipset at the Tech Summit that kicked off early today. However, the chipmaker promised to offer details about its powerful product tomorrow, December 6.

Until then, it’s worth mentioning that, once again, the Snapdragon 845 is the result of the collaboration between Qualcomm and Samsung. ES Jung, president and general manager of the foundry business, Samsung Electronics, confirmed that his company will actually build the Snapdragon 845 chipset.

Xiaomi Founder, Chairman and Chief …

Leagoo T5c available for pre-sale now; comes with Intel X86 Airmont-based chipset

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Samsung Galaxy J5 Prime (2017) leaked specs include Exynos-based chipset, 3GB RAM

Besides the entry-level Galaxy J2 Pro (2018) that we reported about a few days ago, Samsung is likely to launch another cheap smartphone by the end of the year, the Galaxy J5 Prime (2017).

Well, the name isn’t official yet, but there’s a high chance that the leaked device is a sequel to the Galaxy J5 Prime, also known as Samsung SM-G570. The unannounced device that has been recently listed at GFXBench has a consequential model number, SM-G571, which is why we believe it to be a follow-up to the Galaxy J5 Prime.

The sequel to the Galaxy J5 Prime is expected to pack a 1.4GHz quad-core …

Samsung unveils the eventual Galaxy S9 chipset, Exynos 9810

Just like that, Samsung kind of, sort of announced its latest and truest 9-series Exynos processor, the 9810. We say truest, as the 8895 in the Note 8 is still market as 9-series by Samsung, even though it is denoted with an eight at the beginning. Internal code numbers aside, there were plenty of rumors that this new Exynos 9810 will be powering the Galaxy S9 and S9+, but looking at the specs that Samsung listed, we are not so sure about this.

First off, the 9810 is still done with the 10nm production node, albeit with the second generation process …

Samsung Galaxy S9/S9+ to get the new Snapdragon 845 chipset first?

According to a tweet from Russian tech journalist Eldar Murtazin, the Samsung Galaxy S9 and the Samsung Galaxy S9+ will be the first handsets to sport the Snapdragon 845 chipset. Murtazin’s tweet also hints that the 2018 Samsung flagship models will be the only phones using the new chipsets for an unknown period of time. This is similar to what happened earlier this year when Samsung made a deal with Qualcomm, and purchased all of the Snapdragon 835 chips being produced at the time. The silicon ended up inside the Samsung Galaxy S8 and Samsung Galaxy S8+ As a result, LG was forced to use the older …

Kirin 970 chipset hits 1.2Gbps downlink speeds in testing

Huawei’s Kirin 970 chipset is the first to support Category 18 for downlink speeds and Category 13 uplink speeds. This means that the Kirin 970 can reach downlink speeds as fast as 1.2Gbps. And darn if the Kirin 970 didn’t hit that mark in a recent test conducted by Huawei and Rohde & Schwarz. The latter is a German company that manufactures test and measurement equipment for mobile radios.

To achieve this speed, Huawei and R&S used some of the enhancements employed in the field by carriers in this day and age. That includes 4×4 MIMO, and 256QAM. The former allows for additional …

Kinrin 970 chipset hits 1.2Gbps downlink speeds in testing

Huawei’s Kirin 970 chipset is the first to support Category 18 for downlink speeds and Category 13 uplink speeds. This means that the Kirin 970 can reach downlink speeds as fast as 1.2Gbps. And darn if the Kirin 970 didn’t hit that mark in a recent test conducted by Huawei and Rohde & Schwarz. The latter is a German company that manufactures test and measurement equipment for mobile radios.

To achieve this speed, Huawei and R&S used some of the enhancements employed in the field by carriers in this day and age. That includes 4×4 MIMO, and 256QAM. The former allows for additional …

Alleged iPhone X specs leak out: 2.5GHz chipset, high-res display, and 512 GB version

There has never been an iPhone as leaked as the upcoming “all-screen” edition dubbed tentatively iPhone X, and today is no exception. Hours before the actual announcement, the Russkies seemingly strike again, leaking information about the most anticipated phone of the season. We kid, but what you see below is seemingly a screen grab from a carrier database that lists the specs and different versions of one iPhone X.
Since the screen diagonal is listed as 5.8″ with 1125 x 2436 pixels, we can only assume that the alleged screen grab features the “bezel-less” iPhone X rumored …